Reflow & Wet Blast
Equipment for forming bumps and
flip chips using heat in semiconductor packaging process
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flip chips using heat in semiconductor packaging process

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Application - Fluxless Reflow for solder Bump Ball, Cu pillar & CoW Chip Bonding of the HBM
- Vacuum or ATM Reflow System -
Advantages - Void-free Bump Ball Performance
- Various Temperature Profile (Step & Slope Type)
- Outstanding O2 Density Control(<1ppm) at Every Process
- Conduction & Convection Heating Chamber System
- No Chip Sliding on the Flip Chip Process
- Temp Control : 250¡¾1% (Max.450¡É) Real Time Monitoring of Process Wafer Temp.
- Process gas : Formic acid or no Reactant gas
- Process Pressure : Low Pressure(Model : SRS30V) ATM Pressure(Model : SRS300)
- EFEM(2 or 3 Port) : SEMI Standards
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