PRODUCT & TECH

기술과 비지니스를 융합하여 새로운 미래를 만듭니다.

Reflow & Wet Blast

반도체 패키징 공정에서 열을 사용하여
범프(bump)형성 및 플립칩(Flip Chip) 공정을 진행하는 장비 브로셔다운로드
  • Application - Fluxless Reflow for solder Bump Ball, Cu pillar & CoW Chip Bonding of the HBM
    - Vacuum or ATM Reflow System
    Advantages - Void-free Bump Ball Performance
    - Various Temperature Profile (Step & Slope Type)
    - Outstanding O2 Density Control(<1ppm) at Every Process
    - Conduction & Convection Heating Chamber System
    - No Chip Sliding on the Flip Chip Process
    - Temp Control : 250±1% (Max.450℃) Real Time Monitoring of Process Wafer Temp.
    - Process gas : Formic acid or no Reactant gas
    - Process Pressure : Low Pressure(Model : SRS30V) ATM Pressure(Model : SRS300)
    - EFEM(2 or 3 Port) : SEMI Standards